What is BS EN IEC 62878-1 – Assembling device embedded substrates about?
BS EN IEC 62878‑1 is the first part of the international standard used for device embedding assembly technology that specifies the requirements and test methods for device embedded substrates.
BS EN IEC 62878‑1 best practice guidelines can help you in applying safety requirements while performing the test method.
BS EN IEC 62878‑1 specifies the generic requirements and test methods for device embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
BS EN IEC 62878‑1 is applicable to device-embedded substrates fabricated by the use of the organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
Note: BS EN IEC 62878‑1 applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
Who is BS EN IEC 62878‑1 - Assembling device embedded substrates for?
BS EN IEC 62878‑1 on device embedding assembly technology is useful for:
- Manufacturers of electronic devices
- Manufacturers of semiconductor devices
- Manufacturers of printed or circuit boards
- Manufacturers of substrate electronics
Why should you use BS EN IEC 62878‑1 - Assembling device embedded substrates?
Embedded substrate technology is the inclusion of at least one active or passive electrical component within the conductive layers of a substrate.
BS EN IEC 62878‑1 assist you in aligning all the materials with the embedding technology and components that are useful in applying the safety requirements to the base material and components while assembling the embedded substrates. This embedding technology helps in determining the electrostatic discharge that helps in avoiding the defects in device embedded substrates.
The electrical performance tests outlined in BS EN IEC 62878‑1 help you in measuring the electrical characteristics of embedded substrate devices. The mechanical test of devices ensures the resistivity of soldering heat and helps in evaluating the resistance of a device embedded substrates (DES).
BS EN IEC 62878‑1 provides the test method that ensures the sustainability of device embedded substrates in different climatic conditions that result in producing better-quality devices.
Moreover, BS EN IEC 62878‑1 navigates you through the test methods and electrical and mechanical characteristics of device embedded substrates that help in understanding the structure, design and fabrication process and use of device embedded substrates (DES) in the industry.
