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Soft soldering fluxes. Test methods. Assessment of tackiness of flux residues | Status: Current, Under review
description
1 Scope
This document specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.
Details
Publisher
BS
File size
1.86 MB
Pages
12
Format
PDF
Publication date
2017-09-29
ISBN-13
978-0-580-93234-2
ISBN-13 plain
9780580932342
ISBN-10
0580932342