What is BS IEC 62047‑27 - Micro-chevron-tests (MCT) for semiconductor devices about?  
BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices. The main aim of the IEC 62047 series is to provide entities involved with semiconductor technology with best industry techniques to demonstrate the reliability and performance of their devices and components.
BS IEC 62047‑27 specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron samples) under defined load conditions (crack opening mode I). The method is suitable for test samples, which are either produced directly from individual chips in corresponding dimensions, or for integrated samples, which have been singled out from processed wafers using suitable methods. These operational instructions are applicable for symmetrically glass frit bonded silicon-silicon- stacks, i.e. the joint upper and lower chip of the chevron sample exhibit identical thickness and mechanical properties.
Who is BS IEC 62047‑27 - Micro-chevron-tests (MCT) for semiconductor devices for? 
BS IEC 62047‑27 on semiconductor devices is useful for: 
- Semiconductor and microelectromechanical device manufacturers
- Manufacturers of electronic equipment and components
- Semiconductor technology industry
- Automotive industry
- Product design engineers
- Electronics and mechanical engineers
- Quality control and testing agencies
Why should you use BS IEC 62047‑27 - Micro-chevron-tests (MCT) for semiconductor devices?  
MEMS devices, e.g. for automotive applications, have to ensure lifecycles of up to 15 years or more. In order to guarantee the functionality and reliability of the used interconnection technologies, qualified test methods are required for evaluating the quality and strength of the bonding interfaces.
The MCT is an experimental method to determine the fracture toughness of brittle materials or bond interfaces using specifically designed test chips (micro-chevron samples) under defined load conditions. It was established for characterizing the strength of wafer bonds without additional intermediate bond layers. In order to avoid additional shear stress within the bonding interface, and thus avoiding a mixed-mode loading of the bond connection.
Owing to its high precision and low variance, MCT in compliance with BS IEC 62047‑27 is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.
BS IEC 62047‑27 determines preferential dimensions for samples as well as parameters for the test conditions. Deviating geometries can potentially influence the viability of the tests as well as the comparability of the results. On that score, all parameters are determined and documented accurately.
