What is BS IEC 62047‑35 - MEMS bending deformation testing about?
In the recent trend toward ubiquitous sensor society and the world of internet of things, demand for softer electronic devices is quickly expanding. That is what flexible micro-electromechanical devices are for.
To operate such devices, the reliability of the individual devices is a critical concern. Especially in the case of flexible devices, robustness against bending deformation is an important issue which is shared among all the producers and users of such devices.
BS IEC 62047‑35 is part of the IEC 62047 series on microelectromechanical devices. BS IEC 62047‑35 specifies the test method of electrical characteristics under bending deformation for flexible electromechanical devices. These devices include passive micro components and/or active micro components on the flexible film or embedded in the flexible film.
Note: BS IEC 62047‑35 is essential to estimate the safety margin under a certain bending deformation and indispensable for reliable design of the product employing these devices.
Who is BS IEC 62047‑35 - MEMS bending deformation testing for?
BS IEC 62047‑35 on MEMS bending deformation testing is useful for:
- Semiconductor foundries
- Manufacturers of electronic devices
- Manufacturers of automotive parts
- Electronic engineering
Why should you use BS IEC 62047‑35 - MEMS bending deformation testing?
Microelectromechanical devices (MEMS) are a process technology used to create tiny integrated devices or systems that combine mechanical and electrical components.
BS IEC 62047‑35 discusses flexible MEMS which are embedded onto a flexible substrate and operated without unacceptable loss of function under bending deformation. Using BS IEC 62047‑35 tests for folding distance and distance at a defined operation limit, you can determine the loading level of bending deformation for flexible electromechanical devices used in semiconductor devices.
In terms of robustness against bending deformation, critical conditions for possible dangers should be thoroughly determined so that the potential risk can be for the first time managed. In this context, flexible devices should be folded in two at least once so that every possible critical failure actually appears. BS IEC 62047‑35 testing is designed with the emphasis on such a point and with the applicability not only to already emerging flexible devices but also to so-called foldable devices which still function even when the device is folded.
BS IEC 62047‑35 guidelines contribute towards user-safety for those handling MEMS devices.
