BS IEC 62047-38:2021

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Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection | Status: Current

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Publisher BS

File size 1.05 MB

Pages 16

Format PDF

Publication date 2021-07-07

ISBN-13 978-2-832-29908-1

ISBN-13 plain 9782832299081

ISBN-10 2832299081

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File size 1.05 MB

Pages 16

Format PDF

Publication date 2021-07-07

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