What is BS IEC 62899‑202‑6 about?
BS IEC 62899‑202‑6 is a part of a multi-series on printed electronics. BS IEC 62899‑202‑6 is about conductive ink that acts as a connection between other components on printed film. BS IEC 62899‑202‑6 provides a method of in-situ measurement for the resistance change of a conductive layer formed by printing methods on a flexible substrate under specified temperature and humidity conditions.
In BS IEC 62899‑202‑6 an environment reliability test is proposed to evaluate the electrical property and resistance change of a printed conductive film on a flexible substrate.
Who is BS IEC 62899‑202‑6 for?
BS IEC 62899‑202‑6 on printed electronics (printed film circuit boards) is useful for:
- Circuit board manufacturers
- Manufacturers of electronic components like computer chips
- Quality control personnel
- Graphic design printers
Why should you use BS IEC 62899‑202‑6?
As technology has advanced, devices have become more compact. Circuit boards have also evolved. A printed layer on a flexible substrate is widely employed as an electrode or interconnection for flexible devices. Printed film circuit boards are now used on compact devices. Conductive ink prints on the film to make a conductive circuit board. These conductive inks are created by annealing or chemical treating metals. Because of their minuscule dimensions, these conductive inks are prone to environmental factors within electronic devices.
BS IEC 62899‑202‑6 helps you to calculate the resistance change in conductive ink. BS IEC 62899‑202‑6 also provides you with temperature and humidity measurements that arise due to applying current through the circuit for hours. BS IEC 62899‑202‑6 will also show you how these changes in temperature and humidity affect the electrical resistance of conductive inks. This information will help you to determine the performance of conductive ink used in printed electronics, and what factors affect them.
