What is BS IEC 62899-301-2 – Measuring the quality of printing master about?  
BS IEC 62899 is an international standard that discusses printed electronics.
BS IEC 62899-301-2 is one of the parts in the BS IEC 62899 series that defines measurement terms and methods related to the critical dimension of features and the registration accuracy of features on rigid plate masters.
Who is BS IEC 62899-301-2 – Measuring the quality of printing master for? 
BS IEC 62899-301-2 on measurement methods for printed electronics is useful for: 
- Printed electronics device manufacturers
- Printing master manufacturing equipment vendors
- Printing master manufacturers
- Electronic engineering industry
- Product design engineers
Why should you use BS IEC 62899-301-2 – Measuring the quality of printing master?  
There are mainly two categories in printing process for the printed electronics. One is a noncontact printing process such as inkjet printing and electrostatic discharge (ESD) printing process. The other is a contact printing process such as gravure printing, gravure offset printing, reverse offset printing and screen printing.
BS IEC 62899-301-2 provides a proposal for measuring and assessing the printing master, therefore the scope is limited to the printing process using the printing master.
The quality of the printing master is important because the ink is transferred from the printing master to the substrate directly in these processes and it means that the quality of the results of the printed circuit depends on the quality of the printing master. For a mass production of the printed electronic devices, many companies such as device manufacturers, printing master manufacturers and printing master manufacturing equipment vendors are related to manufacturing and they need to use the printing master and the standardized measurement and assessment methods.
General critical dimensions are defined in BS IEC 62899-301-2 to evaluate the shape accuracy of features on the plated master. To evaluate the registration accuracy of features on the plated master, the specification for the registration mark for the plated master is specified.
Common metrology procedures to measure the critical dimensions and the registration accuracy of the plated master are established for device manufacturers, printing master manufacturers, and printing master manufacturing equipment vendors. The measurement terms which are measured by agreement between the user and the supplier are measured using the measurement methods given in BS IEC 62899-301-2.
