What is BS IEC 62899‑402-3 about?
BS IEC 62899‑402 discusses standards for printed electronics. BS IEC 62899‑402‑3 is about printed film that works as a circuit board. BS IEC 62899‑402‑3 specifies the optical measurement method for acquiring two-dimensional images of voids and obtaining the void-related attributes in the dried or cured printed patterns. These cured printed patterns are part of the electronic products included in the field of printed electronics. The measurable voids using this document are limited to those that are distinguishable by the optical image measurement.
BS IEC 62899‑402‑3 contains fundamental information on the measurement of voids in a printed pattern in printed electronics. Void in BS IEC 62899‑402‑3 is defined as a very small non-patterned part of a printed pattern, caused by the printing condition and ink properties, and treated as two-dimensional on a substrate.
Note1: In BS IEC 62899‑402‑3, void means an imperfection of pattern observed from a two-dimensional (2D) top-view.
Note2: BS IEC 62899‑402‑3 excludes the standardization of the measurement system. BS IEC 62899‑402‑3 specifies the properties related to the voids such as numbers, areas, sizes, etc., in the printed pattern obtained from the optical measurement system.
Who is BS IEC 62899‑402‑3 for?
BS IEC 62899‑402‑3 on printed electronics is useful for:
- Circuit board manufacturers
- Manufacturers of electronic components like computer chips
- Graphic printing industry
- Quality control personnel
Why should you use BS IEC 62899‑402‑3?
Voids are minute holes that can be found on the printed pattern in printed electronics. Voids should not exist in the printed patterns which constitute the printed electronics devices to be commercialized for the stable and reliable performance of the devices. The detection and analysis of voids in the pattern can provide guidelines to evaluate the printability of the process, inks, and equipment. This lets you manage and control the performance of the printed electronics devices by measuring and analysing the voids at the patterning process from the point of view of printability.
BS IEC 62899‑402‑3 provides you with a measurement method of voids using a 2D image obtained by a conventional optical microscope or camera. This measurement method in BS IEC 62899‑402‑3 will help you to differentiate between the void and the pattern. BS IEC 62899‑402‑3 gives a method that can capture the voids considering their three-dimensional structure even from the two-dimensional photo image of the pattern.
This simple cost-effective measurement method offers you an easy way to check the voids in the printed pattern during the manufacturing process. BS IEC 62899‑402‑3 will be useful for you to manage the quality of the products at a lower cost
