What is BS IEC 63011-2 about?
BS IEC 63011-2 is the second part of the BS IEC 63011 series of standards that provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys.
Note: These specifications apply only if the electrical coupling method of die-to-die alignment is used in the die stacking.
Who is BS IEC 63011-2 for?
BS IEC 63011-2 on stack dies is useful for:
- Integrated circuits manufacturers
- Electronic appliance manufacturers
Why should you use BS IEC 63011-2?
Three-dimensional (3-D) integration of integrated circuits using through-silicon via (TSV) technology is an innovative solution to simultaneously achieve greater performance, an improved versatility and a higher density of integrated circuits without miniaturization of feature sizes on a die. Die alignment during the die bonding is the key enabler of the fine pitch 3-D wiring between vertically stacked dies for proper physical contact. BS IEC 63011-2 provides specifications of maintenance of the alignment during the bonding process and afterward is as important as the precise overlap prior to die bonding. BS IEC 63011-2 describes a method of initial alignment and maintenance of alignment throughout the die bonding process that can be involved with mechanical shaking. The initial alignment is performed using optical means. During the maintenance period, however, the relative amount of the misalignment is converted to an electrical signal for on-the-fly alignment monitoring without the visual image.
