What is ISO 14606- Sputter-depth profiling parameters about?
ISO 14606 discusses surface chemical analysis. The specific applications of ISO 14606 are as follows:
- Single-layered and multilayered systems on a substrate as reference materials are useful for the optimization of depth resolution as a function of instrument settings in Auger electron spectroscopy, X-ray photoelectron spectroscopy and secondary ion mass spectrometry
- Systems are useful for illustrating the effects of the evenness of the sputter crater, the inclination of the crater bottom, the sample drift, the drift of sputter conditions (for example ion beam current density) on depth resolution
- Systems are useful for illustrating the effects of sputter-induced surface roughening and sputter-induced atomic mixing on depth resolution
- Systems are useful for the evaluation of instrument performance for instrument suppliers and users
- ISO 14606 is timely and topical and can be used as a basis for future development of sputter depth profiling
Note: ISO 14606 is not intended to cover the use of special multilayered systems such as delta-doped layers.
Who is ISO 14606- Sputter-depth profiling parameters for?
ISO 14606 on sputter-depth profiling parameters is useful for:
- Semi-conductor manufacturers
- Chip manufacturers
- Steel manufacturers
- Quality control personnel
Why should you use ISO 14606 - Sputter-depth profiling parameters?
Reference materials are useful in optimizing the depth resolution of sputter profiling methods in materials such as silicon wafers, multilayered devices (for example AlGaAs double-hetero lasers, high electron mobility transistors) and alloy-galvanized steel for corrosion-resistant car bodies.
ISO 14606 gives you guidance on the optimization of sputter-depth profiling parameters using appropriate single-layered and multilayered reference materials to achieve optimum depth resolution as a function of instrument settings in Auger electron spectroscopy, X-ray photoelectron spectroscopy and secondary ion mass spectrometry.
