DD IEC/PAS 62137-3:2009 describes the selection of an appropriate test method for reliability testing of solder joints. The test methods given are applicable to evaluate the strength of joints of a component mounted on printed wiring board, but not to test the mechanical strength of components themselves.
The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range for a component.
Contents of DD IEC/PAS 62137-3:2009
• FOREWORD
• INTRODUCTION
• Scope
• Normative references
• Terms and definitions
• Procedure of selecting the applicable test method
• Stress to solder joints in the field and test methods
• Selection of test methods based on the shapes and terminals of electronic
• components
• Common subjects in each test method
• Mounting device and materials used
• Soldering condition
• Accelerated endurance test
• Selection of test conditions and analysis of test results
• Test method
• Body strength test of SMD before and after the rapid temperature change test
• Cyclic bending strength test
• Mechanical shear fatigue test
• Cyclic drop test
• Strength test of leaded component
• Fillet lifting phenomenon observation of leaded component
• Annex A (informative) Condition of rapid temperature change test
• Annex B (informative) Soldered joint test by electrical conduction
• Annex C (informative) Torque shear strength test
• Annex D (informative) Monotonic bending strength test
• Annex E (informative) Cyclic steel ball drop strength test
• Annex F (informative) Pull strength test
• Annex G (informative) Creep strength test
• Annex H (informative) Fillet lifting phenomenon observation of leaded component solder
• joint and the life test by electrical conduction
