What is IEC TR 61191‑8 about?
PD IEC TR 61191‑8 is the eighth part of the IEC 61191 multi-series that discusses painted board assemblies. gives guidelines for dealing with voiding in surface-mount solder joints of printed board assemblies for use in automotive electronics. This technical report focuses exclusively on voids in solder joints connecting packaged electronic or electromechanical components with printed boards (PBS). Voids in other solder joints (e.g., in a joint between a silicon dies and a substrate within an electronic component, solder joints of through-hole components, etc.) are not considered.
The technical background for the occurrence of voids in solder joints, the potential impact of voiding on printed board assembly reliability and functionality, the investigation of voiding levels in the sample- and series-production by use of X-ray inspection, as well as typical voiding levels in different types of solder joints, are discussed. Recommendations for the control of voiding in series production are also given.
Who is PD IEC TR 61191‑8 for?
PD IEC TR 61191‑8 on printed board assemblies are useful for:
- Electrical and mechanical engineers
- Manufacturing unit of printed board assemblies
- Controlling unit of automotive electronic
Why should you use PD IEC TR 61191‑8?
Most voiding concerns concentrate on reliability issues related to the thermomechanical, mechanical, thermal and electrical performance of solder joints. The reliability assessment is difficult since solder-joint reliability is a highly complex and multi-faceted topic.
PD IEC TR 61191‑8 specifies various types of voiding in solder joints of printed boards and provides you with methods to identify them and the reason for their occurrence.
PD IEC TR 61191‑8 applies to electronic and electromechanical automotive printed board assemblies and describes current best practices for dealing with voiding in solder joints of surface-mount components soldered onto printed boards.
