PD IEC TR 61760-3-1:2022

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Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method | Status: Current

Details

Publisher BS

File size 2.41 MB

Pages 30

Format PDF

Publication date 2022-09-30

ISBN-13 978-2-832-23928-5

ISBN-13 plain 9782832239285

ISBN-10 2832239285

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Points 696

File size 2.41 MB

Pages 30

Format PDF

Publication date 2022-09-30

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