What is PD IEC/TR 62878-2-2 - Electrical testing of device embedded substrate about?
PD IEC/TR 62878-2-2 is the second part of an international standard used for device embedded substrate.
PD IEC/TR 62878-2-2 describes the necessary information on electrical testing for device embedded substrate. This includes the interconnection open- and short-circuit tests as well as the device functional test. It also provides guidelines by demonstrating the electrical test for device embedded substrate.
Note: PD IEC/TR 62878-2-2 is applicable to device embedded substrates fabricated by use of
organic base material, which includes for example active or passive devices, discrete
components formed in the fabrication process of electronic wiring board, and sheet formed
components.
Note: PD IEC/TR 62878-2-2 does not apply to the re-distribution layer (RDL) nor to the electronic
modules defined as an M-type business model in IEC 62421.
Who is PD IEC/TR 62878-2-2 - Electrical testing of device embedded substrate for?
PD IEC/TR 62878-2-2 on Device embedded substrate is useful for:
- Manufacturer of electronic devices
- Manufacturer of automotive part
- Manufacturer of circuit boards
- Electronic engineer
Why should you use PD IEC/TR 62878-2-2 - Electrical testing of device embedded substrate?
Embedded substrate technology is the inclusion of at least one active or passive electrical component within the conductive layers of a substrate.
PD IEC/TR 62878-2-2 can be your best guide in performing the electrical testing of device embedded substrate. This test method is useful in measuring the resistance between wiring nets and component nets. With the help of these test methods, you can determine the electrical performance of these device embedded substrates.
By applying PD IEC/TR 62878-2-2 you can identify the defects in printed circuits and can also check the causes of noise that takes place in the RF system. This helps in manufacturing better quality active and passive devices.
