PD IEC/TS 62647-23:2013 - Page 2

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies | Status: Current

1 Scope This part of IEC 62647 provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as Sn-Pb or Pb-free alloys, or a combination of both solders and surface finishes. This document contains a review of known impacts and issues, processes for rework/repair, focused to provide the technical structure to allow the repair technician to execute the task. This document focuses on the removal and replacement of piece parts. For the purposes of this document, the term “rework/repair” is used as defined in 3.1.29 and 3.1.30. The information contained within this document is based on the current knowledge of the industry at the time of publication. Due to the rapid changing knowledge base, this document should be used for guidance only.

NOTE 1 For the purposes of this document, if the element “lead” is implied, it will be stated either as Pb, as lead (Pb), or as tin-lead. If a piece part terminal or termination “lead” is referred to, such as in a flat pack or a dual-inline package, the nomenclature lead/terminal or lead-terminal will be used.

NOTE 2 Processes identified in the document apply to either rework or repair.

This document may be used by other high-performance and high-reliability industries, at their discretion.