What is PD IEC TS 62647‑4:2018- BGA re-balling about?  
PD IEC TS 62647‑4 is the fourth part of the PD IEC TS 62647 series.
This part of IEC 62647, which is a Technical Specification, defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence, and high reliability products.
Note: IEC TS 62239-1 and EIA-STD-4899 describe the electronic components management program (ECMP).
Note: PD IEC TS 62647‑4 does not apply to column grid array (CGA) components or chip-scale components.
PD IEC TS 62647‑4 re-balling document addresses two types of configurations. For other configuration types, see Annex A for tailoring.
- Configuration 1: A BGA package that will be de-balled and then re-balled with tin-lead balls compatible with a tin-lead soldering assembly process.
- Configuration 2: A BGA package that will be de-balled and then re-balled with Pb-free balls compatible with a Pb-free soldering assembly process.
The intent of PD IEC TS 62647‑4 is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing, and maintaining a new set of processes or the creation of a stand-alone re-balling process.
Note: PD IEC TS 62647‑4 is not intended to address all procedures and processes associated with a deballing/ re-balling facility; it is assumed there are management, quality, manufacturing, safety, calibration, and training processes/procedures in place as well as all the necessary tools and equipment to accomplish the work.
Who is PD IEC TS 62647‑4-BGA re-balling for? 
PD IEC TS 62647‑4 on process management for avionics is useful for: 
- Electronic component manufacturers
- Aerospace electric equipment and system manufacturers
- OEMs
- Industrial sector
- Avionics industry
- Electronics industry
- Companies engaged in re-balling
Why should you use PD IEC TS 62647‑4 - BGA re-balling process management for avionics?  
As the result of RoHS directives, soldering assembly processes have migrated predominantly from tin-lead to Pb-free, and a majority of BGA components manufacturers have converted from tin-lead solder balls to Pb-free solder balls. This has introduced well documented reliability concerns. In the case of a leaded soldering process, a solution can be to replace the Pb-free solder balls on the BGA components with tin-lead solder balls. This can prevent mixing solder alloys.
PD IEC TS 62647‑4 was prepared to standardize the requirements and guidelines for replacing the solder balls on applicable BGA components. The requirements within this document are derived from existing industry standards and collaboration of service providers and customers, typically avionics original equipment manufacturers (OEMs).
PD IEC TS 62647‑4 is intended to be used by de-balling/re-balling providers and customers to incorporate these requirements into their operations to provide a consistent and well-controlled process, or to create a de-balling/re-balling plan that augments their existing processes.
To avoid reliability problems, the BGA de-balling/re-balling process should be qualified and carefully controlled to prevent the possibility of BGA failure after re-balling. Generally, automated processes contribute positively to this objective and are encouraged in the electronic industry.
BGA component construction and materials used should be evaluated for compatibility with the solder re-balling process to ensure that BGA component reliability and integrity are maintained.
Because of the dynamic nature of the transition to lead-free (Pb-free) electronics, these and other similar documents are based on the best information and expertise available; its update will be considered as future knowledge and data are obtained.
Requirements for new BGA component part number qualification are also included. PD IEC TS 62647‑4 identifies the need for the creation of new part numbers for re-balled BGA components, covers the process and testing requirements for the de-balling/re-balling process, and encourages the automated processes due to the ability to control the process.
Companies engaged in re-balling are supposed to have the necessary knowledge, experience and tools, and to customize if needed their own methods for defining a de-balling/re-balling the process that meets the requirements in PD IEC TS 62647‑4.
