What is PD IEC/TS 62878-2-1– Device embedded assembly technology about?  
PD IEC/TS 62878-2-1 is a part of an international standard that focuses on device embedding assembly technology.
PD IEC/TS 62878-2-1 describes the basics of device embedding substrate. It is useful in transferring the information from printed board designers to manufacturers and assemblers.   
PD IEC/TS 62878-2-1 is applicable to device embedded substrates fabricated by use of organic base material, which includes for example active or passive devices, discrete components formed in the fabrication process of the electronic wiring board, and sheet formed components.
Note: The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
Who is PD IEC/TS 62878-2-1 – Device embedded assembly technology for? 
PD IEC/TS 62878-2-1 on device embedding assembly technology is useful for: 
- Manufacturers of electronic devices 
- Manufacturers of semiconductor devices 
- Manufacturers of printed or circuit boards  
- Manufacturers of substrate electronics  
- Embedded industry
Why should you use PD IEC/TS 62878-2-1– Device embedded assembly technology?  
Embedded substrate technology is the inclusion of at least one active or passive electrical component within the conductive layers of a substrate. The purpose of the IEC 62878 series is to achieve a common understanding with respect to structures, test methods, design and fabrication processes, and the use of the device embedded substrate in industry.
PD IEC/TS 62878-2-1 provides guidance with respect to device embedded substrate, fabricated by embedding discrete active and passive electronic devices into one or multiple inner layers of a substrate with electric connections by means of vias, conductor plating, conductive paste, and printing.
The data description summary mentioned in PD IEC/TS 62878-2-1is useful in identifying the type and structure of data.  The data organization and data description mentioned in PD IEC/TS 62878-2-1 could help you in constructing the board used in the device embedded substrate. 
Moreover, PD IEC/TS 62878-2-1 navigates you through the description of the technology for device embedded substrate which is useful in transferring the information from the printed board designers to the manufacturers and assemblers.    
