What is PD IEC/TS 62878-2-4 – Test element groups for device embedded assembly about?
PD IEC/TS 62878-2- is a part of an international standard that focuses on device embedding assembly technology.
PD IEC/TS 62878-2-4 describes the test element group devices as useful when measuring the basic properties of device embedded substrates. It is useful in transferring the information from printed board designers to manufacturers and assemblers.
PD IEC/TS 62878-2-4 is applicable to device embedded substrates fabricated by use of organic base material, which includes for example active or passive devices, discrete components formed in the fabrication process of the electronic wiring board, and sheet formed components.
Note: The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
Who is PD IEC/TS 62878-2-4 – Test element groups for device embedded assembly for?
PD IEC/TS 62878-2-4 on Test element groups for device embedding assembly is useful for:
- Manufacturers of electronic devices
- Manufacturers of semiconductor devices
- Manufacturers of printed or circuit boards
- Manufacturers of substrate electronics
- Embedded industry
Why should you use PD IEC/TS 62878-2-4 – Test element groups for device embedded assembly?
Embedded substrate technology is the inclusion of at least one active or passive electrical component within the conductive layers of a substrate. The purpose of the IEC 62878 series is to achieve a common understanding with respect to structures, test methods, design and fabrication processes, and the use of the device embedded substrate in industry.
PD IEC/TS 62878-2-4 provides guidance with respect to device embedded substrate, fabricated by embedding discrete active and passive electronic devices into one or multiple inner layers of a substrate with electric connections by means of vias, conductor plating, conductive paste, and printing.
PD IEC/TS 62878-2-4 describes the test conditions for device embedded boards to be used in electronics equipment and reliability.
In PD IEC/TS 62878-2-4, “motherboard” indicates the main board to which packages or modules are assembled. Three ranks are specified for evaluation levels for embedded devices (passive and active), board materials, assembly methods, and specification and characteristics of embedding devices.
Moreover, PD IEC/TS 62878-2-4 navigates you through the description of the technology for device embedded substrate which is useful in transferring the information from the printed board designers to the manufacturers and assemblers.
