JEDEC MS-032-A 0
Standard - Ceramic Dual-In-Line (CDIP) Family, .600 inch Row Spacing. Item 11.10-376S.
JEDEC MS-031-A 0
Standard - Ceramic Dual-In-Line (CDIP) Family, .400 inch Row Spacing. Item 11.10-375S.
JEDEC MS-028-C 0
Standard - Addition of Rectangular BGA Variations to BGA Family. Item 11.11-550s.
JEDEC MS-026-D 2001
Standard - Low/Thin Profile Plastic Quad Flat Package, 2.00 mm Footprint, Optional Heat. Item 11.11-521S.
JEDEC MS-025-B 0
Standard - TSOP II, 7.62 mm Body. Change to the Max. Bend Radius and Foot Angle. Item 11.11-518S
JEDEC MS-023-A 0
Standard - Plastic SOJ, .300 inch Body, .050 inch Lead Spacing. Item 11.11-330S.
JEDEC MS-022-B 0
Standard - Metric Plastic Quad Flat Pack 1.0,0.8,0.65 mm. Item 11.11-450S.
JEDEC MS-021-A 0
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .750 inch Row Spacing. R-PDIP-T. Item 11.11-292S.
JEDEC MS-020-B 0
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .600 inch Row Spacing. R-PDIP-T. Item 11.11-291S
JEDEC MS-019-B 0
Standard - Dual-In-Line (Shrink .070 inch) Plastic Package Family .300 inch Row Spacing. R-PDIP-T. Item 11.11-290S.
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JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline
JEDEC SO-014A 2008
Registration - DDR3 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. SKT. Item 11.14-123