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JEDEC

Joint Electron Device Engineering Council

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JEDEC MS-018-A 0

JEDEC ★★★★★

JEDEC MS-018-A 0 Standard - Square Plastic Chip Carrier Family, 1.27 mm/.050 inch Pitch. Item 11.11-252S.

Publication date: 1970-12-01 Points: 540 File size: 186.51 KB Pages: 7 Format: PDF

JEDEC MS-017-B 0

JEDEC ★★★★★

JEDEC MS-017-B 0 Standard - Ceramic PGA .100 inch Pitch Cavity Down . Item 11.10-315.

Publication date: 1970-12-01 Points: 540 File size: 185.94 KB Pages: 4 Format: PDF

JEDEC MS-015-A 0

JEDEC ★★★★★

JEDEC MS-015-A 0 Standard - Side Brazed Ceramic DIPs in .300 inch, .400 inch and .900 inch Center Line Row-to-Row Spacing. Item 11.10-272.

Publication date: 1970-12-01 Points: 540 File size: 242.63 KB Pages: 11 Format: PDF

JEDEC MS-014-A 0

JEDEC ★★★★★

JEDEC MS-014-A 0 Standard - Single Layer Chip Carrier Family, .040 inch Terminal Spacing, Ceramic. Variations AA-AJ. Item 11.3-112.

Publication date: 1970-12-01 Points: 540 File size: 149.04 KB Pages: 4 Format: PDF

JEDEC MS-013F 2015

JEDEC ★★★★★

JEDEC MS-013F 2015 Standard - Very Thick Profile, Plastic Small Outline (SO) Family, 1.27 mm pitch, 7.50 mm (.300 inch) Body Width. B1R-PDSO/SOP/SOIC.

Publication date: 2015-12-01 Points: 540 File size: 262.43 KB Pages: 7 Format: PDF

JEDEC MS-012F 2008

JEDEC ★★★★★

JEDEC MS-012F 2008 Standard - Plastic Small Outline (SO) Family Peripheral Terminals, 1.27 mm Pitch, 3.90 mm Body Width (Mold Flash and End Protrusion). R-PDSO/SOP/SOIC. Item 11.11-801(s).

Publication date: 2008-12-01 Points: 540 File size: 173.98 KB Pages: 5 Format: PDF

JEDEC MS-011-B 0

JEDEC ★★★★★

JEDEC MS-011-B 0 Standard - Plastic DIP .600 inch Row Spacing, 48 Lead. Addition of Variation AD. Item 11.4-238.

Publication date: 1970-12-01 Points: 540 File size: 69.75 KB Pages: 2 Format: PDF

JEDEC MS-010-C 0

JEDEC ★★★★★

JEDEC MS-010-C 0 Standard - Plastic DIP .400 inch Row Spacing, 28 and 32 Leads. Addition of Variations AC and AD. Item 11.11-306.

Publication date: 1970-12-01 Points: 540 File size: 121.17 KB Pages: 4 Format: PDF

JEDEC MS-009-A 0

JEDEC ★★★★★

JEDEC MS-009-A 0 Standard - .040 inch Center Leadless Chip Carrier Packages. Variations AA-AJ.

Publication date: 1970-12-01 Points: 540 File size: 253.52 KB Pages: 7 Format: PDF

JEDEC MS-008-A 0

JEDEC ★★★★★

JEDEC MS-008-A 0 Standard - .050 inch Center Lead Chip Carrier, Type B. Variations BA-BH.

Publication date: 1970-12-01 Points: 540 File size: 172.12 KB Pages: 5 Format: PDF

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JEDEC JEP162A-2019

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jedec JEP 122G

jedec JEP 122G

JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.

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JEDEC JESD79-3-3 2013

JEDEC JESD79-3-3 2013

ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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JEDEC JESD79-4-1B-2021

JEDEC JESD79-4-1B-2021

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9301-2018

IPC JEDEC 9301-2018

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IPC JEDEC 9703-2009 (2019)

IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

EIA JEDEC JESD67-1999 errata 1999

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline

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JEDEC SO-014A 2008

JEDEC SO-014A 2008

Registration - DDR3 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. SKT. Item 11.14-123