JEDEC MO-005-B 0
Registration - Grid Array Family, 3.18 mm Pitch. Variations AA-AB.
JEDEC MO-004-C 0
Replaced - See MS-033-A. Item 11.10-382S. (Flatpack Family, .300 Width, .050 Pitch. Variations AJ-AM. Item 11.10-391).
JEDEC MO-002-C 0
Registration - Header Family .200 inch Pin Circle. Variations AJ-AL. Ref. TO-80, TO-99.
JEDEC MO-002-B 0
Registration - Header Family .200 inch Pin Circle. Variations AA-AH. Ref. TO-76, TO-73, TO-74, TO-75, TO-77, TO-78, T...
JEDEC MO-001-F 1983
Registration - Dual in-line Family. 7.62 mm Row Spacing. Variations: AJ-AM.
JEDEC MCP3.12.3 2006
Silicon Pad Sequence (x16/x32 LPDRAM, x16 PSRAM, x16 NAND). Item JC-63-029
JEDEC MCP3.12.2 2012
Package-on-Package (PoP) and Internal Stacked Module (ISM)
JEDEC MCP3.12.0 2006
MCP Overview
JEDEC JS9702 2004
IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)
JEDEC JS709C 2018
JOINT JEDEC/ECA STANDARD, DEFINITION OF _LOW-HALOGEN_ FOR ELECTRONIC PRODUCTS
Hot Products
JEDEC JESD82-513-2023
JEDEC JESD82-511-2021
JEDEC JESD79-5C-2024
JEDEC JESD82-512-2023
JEDEC JESD79-3F-2012
JEDEC JESD79-4D-2021
JEDEC JESD79-5B-2022
JEDEC JEP162A-2019
jedec JEP 122G
JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.
JEDEC JESD79-3-3 2013
ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM
JEDEC JESD79-4-1B-2021
IPC JEDEC 9301-2018
JEDEC CS-002-A 1993
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
IPC JEDEC 9703-2009 (2019)
JEDEC JESD82-30.01-2023
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC JESD88E 2013
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline