JEDEC JS709B 2015
JOINT JEDEC/ECA STANDARD, DEFINITION OF _LOW-HALOGEN_ FOR ELECTRONIC PRODUCTS
JEDEC JS002-2014 2015
ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING _ CHARGED DEVICE MODEL (CDM) _ DEVICE LEVEL
JEDEC JS-002-2022 2023
ESDA/JEDEC JOINT STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TESTING _ CHARGED DEVICE MODEL (CDM) _ DEVICE LEVEL
JEDEC JS-001-2023 2023
JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
JEDEC JS-001-2017 2017
JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL
JEDEC JP002 2006
CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
JEDEC JP001A 2014
FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)
JEDEC JMTest 2013
JEDEC Test Document
JEDEC JM7.01 2010
STYLE MANUAL FOR STANDARDS AND OTHER PUBLICATIONS OF JEDEC
JEDEC JM5.01 2023
JEDEC Legal Guidelines
Hot Products
JEDEC JESD82-513-2023
JEDEC JESD82-511-2021
JEDEC JESD79-5C-2024
JEDEC JESD82-512-2023
JEDEC JESD79-3F-2012
JEDEC JESD79-4D-2021
JEDEC JESD79-5B-2022
JEDEC JEP162A-2019
jedec JEP 122G
JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.
JEDEC JESD79-3-3 2013
ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM
JEDEC JESD79-4-1B-2021
IPC JEDEC 9301-2018
JEDEC CS-002-A 1993
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
IPC JEDEC 9703-2009 (2019)
JEDEC JESD82-30.01-2023
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC JESD88E 2013
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline