PD IEC TR 61760-5-1:2024

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Surface mounting technology. Surface strain on circuit board. Strain gauge measurement applied to chip components | Status: Current

description

1 Scope This document describes examples of methods using electrical strain gauges for determination of critical mechanical stresses in assembly processes. These stresses can damage chip type ceramic components, causing so called “bending cracks”. Area-array components are excluded from the scope of this document.

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Publisher BS

File size 4.71 MB

Pages 28

Format PDF

Publication date 2024-02-07

ISBN-13 978-2-832-28160-4

ISBN-13 plain 9782832281604

ISBN-10 2832281604

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File size 4.71 MB

Pages 28

Format PDF

Publication date 2024-02-07

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