What is PD IEC/TS 62647-3 - Systems containing lead-free solder and finishes about?
PD IEC/TS 62647-3 is the third part of an international standard used for Process management for avionics that specifies the test methods and test procedure for systems containing lead-free solder and finishes. PD IEC/TS 62647-3 helps in avoiding the defects or failures in systems containing lead-free solder and finishes.
PD IEC/TS 62647-3 defines for circuit card assemblies (CCA):
- A default method for those companies that require a pre-defined approach, and
- A protocol for those companies that wish to develop their own test methods.
The intent of PD IEC/TS 62647-3 is not to prescribe a certain method, but to aid avionics/defence suppliers in satisfying the reliability and/or performance requirements of IEC/TS 62647-1 as well as support the expectations in IEC/TS 62647-21. The default method is intended for use by electronic equipment manufacturers, repair facilities, or programs that, for a variety of reasons, may be unable to develop methods specific to their own products and applications. The protocol is intended for use by manufacturers or repair facilities that have the necessary resources to design and conduct reliability, qualification, or process development tests that are specific to their products, their operating conditions, and their applications.
Any portion of this document can be used to develop a lead-free (Pb-free) assembly test program, i.e., this document is tailorable and provides room for flexibility. For those situations in which results are used for reliability, verification, or qualification, stakeholder concurrence needs to be sought and documented so that expectations are understood and addressed.
This specification may be used for products in all stages of the transition to lead-free (Pbfree) solder, including:
- Products that have been designed and qualified with traditional tin-lead electronic components, materials, and assembly processes, and are being re-qualified with use of lead-free (Pb-free) components
- Products with tin-lead designs transitioning to lead-free (Pb-free) solder; and
- Products newly-designed with lead-free (Pb-free) solder
With respect to products as mentioned above, the methods presented in this document are intended to be applied at the level of assembly at which soldering occurs, i.e., circuit card assembly (CCA) level. This document may be used by other high-performance and high-reliability industries, at their discretion.
Who is PD IEC/TS 62647-3 - Systems containing lead-free solder and finishes for?
PD IEC/TS 62647-3 on Process management for avionics is useful for:
- Aerospace
- Manufacturer of electronic devices
- Defence
- Manufacturer of automotive parts
- Electronic engineer
Why should you use PD IEC/TS 62647-3 - Systems containing lead-free solder and finishes?
Avionics are useful in communicating and navigating from one place to another place.
PD IEC/TS 62647-3 specifies the default test method and test procedure for systems containing lead-free solder and finishes. The test method are as follows:
- Pre-conditioning by the thermal aging method
- Thermal aging acceleration model
- Default temperature cycle test method
- Vibration test
- Mechanical shock
- Combined environments
This test method is useful in avoiding the defects and failures in solder joints and ensures the sustainability of these systems in different climatic conditions. By applying PD IEC/TS 62647-3 you can evaluate the performance and helps in manufacture good quality systems containing lead-free solder.
What’s changed since the last update?
PD IEC/TS 62647-3:2014 supersedes DD IEC/PAS 62647-3:2011. PD IEC/TS 62647-3:2014 includes some technical changes with respect to DD IEC/PAS 62647-3:2011. These include:
- Terms and definition subclause changed in Clause 3
- Coherence with IEC/TS 62647-1, IEC/TS 62647-21 and IEC/TS 62647-22 definitions
- Introduction of “g-force” definition
- Reference to IEC 62647 documents when already published
- Harmonization of preconditioning data at Table B.1 level with regard to 5.3.3
