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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-281-A 2006

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JEDEC MO-281-A 2006 Registration - DDR2 SDRAM DIMM (Dual Inline memory Module) Family, Flex-Based, 1.00 mm Contact Centers.

Publication date: 2006-12-01 Points: 540 File size: 170.96 KB Pages: 9 Format: PDF

JEDEC MO-280-A 2006

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JEDEC MO-280-A 2006 Registration - Ultra Thin and Very, Very Thin Profile, Fine Pitch Ball Grid Array (BGA) Family - SQUARE. (U,W)F-XBGA.

Publication date: 2006-12-01 Points: 540 File size: 448.26 KB Pages: 7 Format: PDF

JEDEC MO-279-A 2006

JEDEC ★★★★★

JEDEC MO-279-A 2006 Registration - 10 Pin Micro Size MultiMediaCard (MMC) Outline - MMCmicro 14 x 12 x 1.1 mm. RT-PLGA/MMCmicro.

Publication date: 2006-12-01 Points: 540 File size: 138.07 KB Pages: 5 Format: PDF

JEDEC MO-278-A 2006

JEDEC ★★★★★

JEDEC MO-278-A 2006 Registration - 13 Pin Reduced Size MultiMediaCard (MMC) Outline - MMCmobile 18 x 24 x 1.4 mm. RL-PLGA/MMCmobile.

Publication date: 2006-12-01 Points: 540 File size: 202.03 KB Pages: 6 Format: PDF

JEDEC MO-277-A 2006

JEDEC ★★★★★

JEDEC MO-277-A 2006 Registration - 13 Pin Full Size MultiMediaCard (MMC) Outline - MMCplus 32 x 24 x 1.4 mm. RL-PLGA/MMCplus.

Publication date: 2006-12-01 Points: 540 File size: 173.47 KB Pages: 6 Format: PDF

JEDEC MO-276L 2017

JEDEC ★★★★★

JEDEC MO-276L 2017 Registration - Fine Pitch Ball Grid Array Family, Rectangular , 0.50 mm Pitch. FR-XBGA, (L,T,V)FR-XBGA.

Publication date: 2017-12-01 Points: 540 File size: 887.7 KB Pages: 24 Format: PDF

JEDEC MO-275-A.01 2011

JEDEC ★★★★★

JEDEC MO-275-A.01 2011 Registration - Low profile, Fine Pitch Ball Grid Array Family, Square. LF-XBGA. Item 11.11-751E.

Publication date: 2011-12-01 Points: 540 File size: 678.66 KB Pages: 13 Format: PDF

JEDEC MO-274D 2014

JEDEC ★★★★★

JEDEC MO-274D 2014 Registration - DDR1/DDR2/DDR3, 144 Pin, 16b/32b Small Outline Dual Inline Memory Module (SODIMM) Family, 0.8 mm Pitch. DIMM

Publication date: 2014-12-01 Points: 540 File size: 417.79 KB Pages: 12 Format: PDF

JEDEC MO-273C 2011

JEDEC ★★★★★

JEDEC MO-273C 2011 Registration - Upper PoP Package, Square, Fine Pitch, Ball Grid Array (BGA), 0.65 and 0.50 mm and 0.40 mm Pitch. POP-XFBGA.

Publication date: 2011-12-01 Points: 540 File size: 550.93 KB Pages: 8 Format: PDF

JEDEC MO-272-A 2006

JEDEC ★★★★★

JEDEC MO-272-A 2006 Registration - Low profile, Exposed pads, Plastic Small Outline Family, with 3.90 mm Body Size. (F) L-PDSO/SOIC, LSOP.

Publication date: 2006-12-01 Points: 540 File size: 319.78 KB Pages: 6 Format: PDF

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JEDEC JEP162A-2019

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jedec JEP 122G

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JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.

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JEDEC JESD79-3-3 2013

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ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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JEDEC JESD79-4-1B-2021

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline