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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-260-C 2006

JEDEC ★★★★★

JEDEC MO-260-C 2006 Registration - DDR and DDR2 Micro DIMM Mezzanine, 214 pin, 0.4 mm Lead Centers.

Publication date: 2006-12-01 Points: 540 File size: 472.85 KB Pages: 11 Format: PDF

JEDEC MO-259-A 2005

JEDEC ★★★★★

JEDEC MO-259-A 2005 48 Lead, Very, Very Thin Small Outline Package, Type 1. WR-PDSO1, WSOP1. Item 11.11-701.

Publication date: 2005-12-01 Points: 540 File size: 105.88 KB Pages: 4 Format: PDF

JEDEC MO-258-A 2004

JEDEC ★★★★★

JEDEC MO-258-A 2004 Registration - 200 pin DDR MiniDIMM. 0.60 mm Lead Centers. Item 11.14-069.

Publication date: 2004-12-01 Points: 540 File size: 244.02 KB Pages: 5 Format: PDF

JEDEC MO-257-B 2005

JEDEC ★★★★★

JEDEC MO-257-B 2005 Registration - Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707.

Publication date: 2005-12-01 Points: 540 File size: 216.52 KB Pages: 6 Format: PDF

JEDEC MO-256-F 2007

JEDEC ★★★★★

JEDEC MO-256-F 2007 Registration - FBDIMM (Fully Buffered Dual Inline Memory Module) Family, 1.00 mm Contact Centers.

Publication date: 2007-12-01 Points: 540 File size: 879.1 KB Pages: 22 Format: PDF

JEDEC MO-255-B 2005

JEDEC ★★★★★

JEDEC MO-255-B 2005 Registration - Plastic Very Very Thin, Ultra Thin, and Extremely Thin, Fine Pitch Quad Flat Small Outline, Non-Leaded Package Family. P-XFQFN. Item 11.11-678.

Publication date: 2005-12-01 Points: 540 File size: 415.35 KB Pages: 6 Format: PDF

JEDEC MO-254-A 2004

JEDEC ★★★★★

JEDEC MO-254-A 2004 Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686.

Publication date: 2004-12-01 Points: 540 File size: 133.06 KB Pages: 5 Format: PDF

JEDEC MO-252D 2010

JEDEC ★★★★★

JEDEC MO-252D 2010 Registration - Plastic Very Very Thin, Ultra Thin and Extremely Thin, Fine Pitch Dual, Small Outline, Non-leaded Package Family. (W, U, X)F-PSON.

Publication date: 2010-12-01 Points: 540 File size: 36.55 KB Pages: 9 Format: PDF

JEDEC MO-251-A 2004

JEDEC ★★★★★

JEDEC MO-251-A 2004 Registration - Thermally Enhanced Plastic Very Thick, Quad Flat No Lead Package. HE-PQFP-N. Item 11.11-657.

Publication date: 2004-12-01 Points: 540 File size: 223.45 KB Pages: 7 Format: PDF

JEDEC MO-250-A 2003

JEDEC ★★★★★

JEDEC MO-250-A 2003 Registration - New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679.

Publication date: 2003-12-01 Points: 540 File size: 173.6 KB Pages: 7 Format: PDF

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jedec JEP 122G

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JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.

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JEDEC JESD79-3-3 2013

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ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline