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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-271-A 2006

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JEDEC MO-271-A 2006 Registration - Small outline packages (7.60 mm body width) with an exposed pad. (F)-PDSO / SOIC, SOP.

Publication date: 2006-12-01 Points: 540 File size: 239.66 KB Pages: 6 Format: PDF

JEDEC MO-270-B 2008

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JEDEC MO-270-B 2008 Registration - Extra Thin Profile, Fine Pitch, Internal Stacking Module (ISM) with Single Interconnect Array (0.75/0.80 mm Pitch, Square, Rectangular). X1F-XLGA.

Publication date: 2008-12-01 Points: 540 File size: 359.16 KB Pages: 8 Format: PDF

JEDEC MO-269J 2014

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JEDEC MO-269J 2014 Registration - 240 Pin DDR3 DIMM (Dual Inline Memory Module) Family with 1.00 mm pitch. DIM

Publication date: 2014-12-01 Points: 540 File size: 1.02 MB Pages: 33 Format: PDF

JEDEC MO-268E 2014

JEDEC ★★★★★

JEDEC MO-268E 2014 Registration - 204 Pin DDR3 SODIMM w/ 0.60 mm Pitch. DIM

Publication date: 2014-12-01 Points: 540 File size: 710.62 KB Pages: 24 Format: PDF

JEDEC MO-267-B 2006

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JEDEC MO-267-B 2006 Registration - Punch-Singulated, Fine Pitch, Square, Very Thin, Leadframe-Based Quad No-Lead Staggered Dual-Row (With Optional Thermal Enhancements) QFN Package Family. HVF-PQFN.

Publication date: 2006-12-01 Points: 540 File size: 198.74 KB Pages: 8 Format: PDF

JEDEC MO-265-A 2005

JEDEC ★★★★★

JEDEC MO-265-A 2005 Registration - Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN.

Publication date: 2005-12-01 Points: 540 File size: 96.78 KB Pages: 4 Format: PDF

JEDEC MO-264-A 2005

JEDEC ★★★★★

JEDEC MO-264-A 2005 Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, Dual Pitch. AFR-PDSB.

Publication date: 2005-12-01 Points: 540 File size: 616.63 KB Pages: 5 Format: PDF

JEDEC MO-263-A 2005

JEDEC ★★★★★

JEDEC MO-263-A 2005 Registration - 0.50 and 0.40 mm pitch Very Thin and Very-Very Thin Flange-Molded QFNs. VF-PQFN, WF-PFQN.

Publication date: 2005-12-01 Points: 540 File size: 141.87 KB Pages: 7 Format: PDF

JEDEC MO-262-A 2005

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JEDEC MO-262-A 2005 Registration - 0.50 mm pitch Very Thin and Very-Very Thin Flange-Molded Thermally Enhanced (Top Side) QFNs. HVF-PQFN, HWF-PQFN.

Publication date: 2005-12-01 Points: 540 File size: 141.18 KB Pages: 7 Format: PDF

JEDEC MO-261-A 2005

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JEDEC MO-261-A 2005 Registration - Thick and Very Thick, Fine-Pitch, Retangular Ball Grid Array Family, 0.80 mm Pitch. B1FR-XBGA, BFR-XBGA.

Publication date: 2005-12-01 Points: 540 File size: 324.54 KB Pages: 6 Format: PDF

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JEDEC JEP162A-2019

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jedec JEP 122G

jedec JEP 122G

JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.

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JEDEC JESD79-3-3 2013

JEDEC JESD79-3-3 2013

ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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JEDEC JESD79-4-1B-2021

JEDEC JESD79-4-1B-2021

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IPC JEDEC 9301-2018

IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline