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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-148-A 1993

JEDEC ★★★★★

JEDEC MO-148-A 1993 Registration - Multichip Module (MCM) Ceramic Quad Flatpack Family. S-CQFP.

Publication date: 1993-12-01 Points: 540 File size: 325.07 KB Pages: 9 Format: PDF

JEDEC MO-147-A 1994

JEDEC ★★★★★

JEDEC MO-147-A 1994 Registration - Small Outline J-Lead (SOJ) Ceramic Chip Carrier, .415 inch Body, .050 inch Lead Spacing. R-CDSO-J.

Publication date: 1994-12-01 Points: 540 File size: 94.93 KB Pages: 4 Format: PDF

JEDEC MO-146-A 0

JEDEC ★★★★★

JEDEC MO-146-A 0 Registration - Ceramic Flatpack Family .380 inch Width, .025 Pitch. R-GDFP-F. Item 11.10-320.

Publication date: 1970-12-01 Points: 540 File size: 75.81 KB Pages: 3 Format: PDF

JEDEC MO-145-A 0

JEDEC ★★★★★

JEDEC MO-145-A 0 Registration - .050 inch Center Ceramic Surface Mount Pin Grid Array (PGA) Family. S-CPGA-B/SMTPGA. Item 11.10-324.

Publication date: 1970-12-01 Points: 540 File size: 298.91 KB Pages: 8 Format: PDF

JEDEC MO-144-A 0

JEDEC ★★★★★

JEDEC MO-144-A 0 Registration - Leadless Small Outline Ceramic Chip Carrier, .350 inch Body, .050 inch Pitch. R-CDCC-N. Item 11.10-319.

Publication date: 1970-12-01 Points: 540 File size: 60.48 KB Pages: 2 Format: PDF

JEDEC MO-143-C 0

JEDEC ★★★★★

JEDEC MO-143-C 0 Replaced - See MS-029-A. Item 11.11-484S. (Fine Pitch QFP, 0.5, 0.4 mm Pitch. S-PQFP-G/FQFP).

Publication date: 1970-12-01 Points: 540 File size: 474.69 KB Pages: 10 Format: PDF

JEDEC MO-142-D 0

JEDEC ★★★★★

JEDEC MO-142-D 0 Registration - Thin Small Outline Package (Type I). S-PDSO-G/TSOP. Correction of the L min value from 0.05 mm to 0.50 mm. Item 11.1-583E

Publication date: 1970-12-01 Points: 540 File size: 124.36 KB Pages: 5 Format: PDF

JEDEC MO-141-A 0

JEDEC ★★★★★

JEDEC MO-141-A 0 Registration - Vertical Surface Mount Package, 0.50 mm Lead Pitch, R-PSIP-X24. Item 11.11-319.

Publication date: 1970-12-01 Points: 540 File size: 127.94 KB Pages: 5 Format: PDF

JEDEC MO-140-A 0

JEDEC ★★★★★

JEDEC MO-140-A 0 Registration - 18 Lead Flange-Mounted Ceramic Power Package. R-CDFM-T18. Item 11.10-312.

Publication date: 1970-12-01 Points: 540 File size: 80.04 KB Pages: 3 Format: PDF

JEDEC MO-139-A 0

JEDEC ★★★★★

JEDEC MO-139-A 0 Registration - 16 Lead Flange-Mounted Ceramic Power Package. (Type 2), R-CDFM-T16. Item 11.10-311.

Publication date: 1970-12-01 Points: 540 File size: 74.33 KB Pages: 3 Format: PDF

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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JEDEC CO-022-A 0

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Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

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DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline