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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-138-A 1993

JEDEC ★★★★★

JEDEC MO-138-A 1993 Registration - 16 Lead Flange-Mounted Ceramic Power Package (Type 1). R-CDFM-T16.

Publication date: 1993-12-01 Points: 540 File size: 79.07 KB Pages: 3 Format: PDF

JEDEC MO-137E 2010

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JEDEC MO-137E 2010 Registration - Plastic Shrink Small Outline Package (SSOP) Family. R-PDSO/SSOP/SOIC.

Publication date: 2010-12-01 Points: 540 File size: 201.67 KB Pages: 5 Format: PDF

JEDEC MO-135-C 0

JEDEC ★★★★★

JEDEC MO-135-C 0 Registration - Thin Small Outline Package (TSOP II) 12.70 mm Body Family. Item 11.11-358.

Publication date: 1970-12-01 Points: 540 File size: 145.71 KB Pages: 4 Format: PDF

JEDEC MO-134-A 1992

JEDEC ★★★★★

JEDEC MO-134-A 1992 Registration - Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317.

Publication date: 1992-12-01 Points: 540 File size: 218.29 KB Pages: 6 Format: PDF

JEDEC MO-133-A 2000

JEDEC ★★★★★

JEDEC MO-133-A 2000 Replaced - See MS-024-E.

Publication date: 2000-12-01 Points: 540 File size: 243.67 KB Pages: 7 Format: PDF

JEDEC MO-132-B 0

JEDEC ★★★★★

JEDEC MO-132-B 0 Registration - TSOP I, 7.62 mm Body. Item 11.11-346.

Publication date: 1970-12-01 Points: 540 File size: 122 KB Pages: 4 Format: PDF

JEDEC MO-131-A 0

JEDEC ★★★★★

JEDEC MO-131-A 0 Registration - Top Brazed Ceramic Leaded Chip Carrier (.025 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-290.

Publication date: 1970-12-01 Points: 540 File size: 148.08 KB Pages: 5 Format: PDF

JEDEC MO-130-A 0

JEDEC ★★★★★

JEDEC MO-130-A 0 Registration - Top Brazed Ceramic Leaded Chip Carrier (.015 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-299.

Publication date: 1970-12-01 Points: 540 File size: 194.23 KB Pages: 7 Format: PDF

JEDEC MO-129-A 0

JEDEC ★★★★★

JEDEC MO-129-A 0 Registration - Top Brazed Ceramic Leaded Chip Carrier (.020 inch Lead Pitch) with Plastic Non-Conductive Tie Bar. Item 11.10-298.

Publication date: 1970-12-01 Points: 540 File size: 126.38 KB Pages: 5 Format: PDF

JEDEC MO-128-C 0

JEDEC ★★★★★

JEDEC MO-128-C 0 Registration - Ceramic Staggered PGA 100 inch Centers (Large Outline). Variations AA-BQ. Item 11.10-365.

Publication date: 1970-12-01 Points: 540 File size: 347.83 KB Pages: 8 Format: PDF

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JEDEC CS-002-A 1993

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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

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DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline