JEDEC MO-159-B 0
Registration - Ceramic CGA Rectangular. Item 11.10-371.
JEDEC MO-158-D 2002
Registration - The addition of 47.5, 50.0, 52.5 and 55.0 mm body variations with 1.27 mm and 1.00 mm ball pitch to Co...
JEDEC MO-157-C 2005
Registration - Rectangular Ceramic Ball Grid Array (BGA) Family. CBGA. Item 11.10-433.
JEDEC MO-156-C 2005
Registration - Square Ceramic Ball Grid Array (BGA) Family. 1.00, 1.27, and 1.50 mm pitch. CBGA. Item 11.10-432
JEDEC MO-155-A 0
Registration - Plastic Small Outline (SOP), 5-Lead. Item 11.11-364.
JEDEC MO-154-C 0
Registration - Shrink Small Outline Package Family, 0.4mm and .5 mm Lead Pitch, SSOP 3.9 mm Body Width, Addition of 8...
JEDEC MO-153-F 2001
Registration - Plastic Thin SSOP R-PDSO-G/TSSOP/HTSSOF, Addition of A1 clarification note (note 14). Item 11.11-603
JEDEC MO-152-C 0
Registration - Plastic Shrink Small Outline Package (SSOP). R-PSDO-G/SSOP. Item 11.11-440.
JEDEC MO-150-B 1994
Registration - Plastic Shrink Small Outline Package (SSOP), 5.3 mm Body Width. R-PDSO-G.
JEDEC MO-149-F 2003
Registration - Tape Ball Grid Array. XBGA-B/TBGA. Item 11.4-665.
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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
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Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
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JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline