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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-117-A 0

JEDEC ★★★★★

JEDEC MO-117-A 0 Registration - Small Outline Plastic Package 12 mm Wide Body with Gullwing, 0.80 mm Lead Spacing. Item 11.11-289.

Publication date: 1970-12-01 Points: 540 File size: 91.59 KB Pages: 4 Format: PDF

JEDEC MO-116-B 0

JEDEC ★★★★★

JEDEC MO-116-B 0 Registration - 72 Circuit Pluggable Single-In-Line Memory Module (SIMM) with Tabs on .050 inch Centers. Item 11.14-023S.

Publication date: 1970-12-01 Points: 540 File size: 320.48 KB Pages: 6 Format: PDF

JEDEC MO-115-A 0

JEDEC ★★★★★

JEDEC MO-115-A 0 Registration - Bottom-Brazed Lead Flatpack Family, 32 Leads, .480 inch Wide . Item 11.10-302.

Publication date: 1970-12-01 Points: 540 File size: 70.36 KB Pages: 2 Format: PDF

JEDEC MO-114-C 0

JEDEC ★★★★★

JEDEC MO-114-C 0 Registration - 28 mm Glass Sealed Ceramic Quad Flatapack Family Gullwing Leadform 0.65, 0.80 mm Pitch. Item 11.10-357

Publication date: 1970-12-01 Points: 540 File size: 227.98 KB Pages: 7 Format: PDF

JEDEC MO-113-D 0

JEDEC ★★★★★

JEDEC MO-113-D 0 Registration - Ceramic Quadpack Family 0.025 inch Lead Spacing With Ceramic Nonconductive Tie Bar. Item 11.10-369.

Publication date: 1970-12-01 Points: 540 File size: 243.95 KB Pages: 7 Format: PDF

JEDEC MO-112-B 0

JEDEC ★★★★★

JEDEC MO-112-B 0 Registration - Metric Quad Flatpack Family (Plastic) 3.9 mm Footprint. Item 11.11-422.

Publication date: 1970-12-01 Points: 540 File size: 443.04 KB Pages: 12 Format: PDF

JEDEC MO-111-A 0

JEDEC ★★★★★

JEDEC MO-111-A 0 Registration - Family of Round Leads, .050 inch Pitch, Gullwing Leadform, Center Ceramic Chip Carrier. Item 11.10-293.

Publication date: 1970-12-01 Points: 540 File size: 401.84 KB Pages: 8 Format: PDF

JEDEC MO-110-A 0

JEDEC ★★★★★

JEDEC MO-110-A 0 Registration - Round Lead, inchJ inch Form Square Body, .050 inch Pitch Center Ceramic Chip Carrier. Item 11.10-292.

Publication date: 1970-12-01 Points: 540 File size: 413.7 KB Pages: 8 Format: PDF

JEDEC MO-109-B 0

JEDEC ★★★★★

JEDEC MO-109-B 0 Registration - TapePak_ Molded Carrier Ring Family, Zero Degree Minimum Lead Bend. Item 11.11-329.

Publication date: 1970-12-01 Points: 540 File size: 219.38 KB Pages: 7 Format: PDF

JEDEC MO-108-C 0

JEDEC ★★★★★

JEDEC MO-108-C 0 Registration - Metric Plastic Quad Flatpack, 1.0, 0.8, 0.65 mm. Item 11.11-449.

Publication date: 1970-12-01 Points: 540 File size: 287.4 KB Pages: 8 Format: PDF

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JEDEC JESD79-3-3 2013

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline