JEDEC MO-107-A 0
Registration - Ceramic Multilayer Leaded Chip Carrier ,.050 inch Pitch, J-Bend Leadform, 20 mil min. Item 11.10-284.
JEDEC MO-106-A 0
Registration - Flatpack Family for High Speed ECL Memory Devices, .535 inch Length, .030 inch Pitch (22, 24 and 28 Pi...
JEDEC MO-105-A 0
Registration - Thin Small Outline J-Lead (TSOJ) .300 inch Body, 0.050 inch Lead Pitch. Item 11.11-272.
JEDEC MO-104-A 0
Registration - Ceramic Quad (CERQUAD) Flatpack, 0.025 inch Pitch, Gullwing Leadform (132 Leads). Item 11.10-283.
JEDEC MO-103-B 0
Registration - Dual-In-Line Cerdip Family .600 inch Row Spacing. Item 11.10-383
JEDEC MO-100-A 0
Registration - Multilayer Ceramic Quad Flatpack .020 Spacing Gullwing (256 leads). Item 11.10-271
JEDEC MO-099-A 0
Registration - Small Outline (SO) Family Peripheral Terminals .440 inch Body Width (Plastic), 28 and 32 Leads with 0....
JEDEC MO-098-A 0
Registration - Bottom Brazed Lead Flatpack Family (10, 14, 16 and 18 Leads). Item 11.10-280.
JEDEC MO-097-A 0
Registration - Flange-Mounted Family Axial Lead .600 inch Pin Circle. Item 11.10-273.
JEDEC MO-096-A 0
Registration - Flange-Mounted Header, 7-Lead. Item 11.10-260.
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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
IPC JEDEC 9703-2009 (2019)
JEDEC JESD82-30.01-2023
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC JESD88E 2013
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline