JEDEC MO-085-A 0
Registration - .040 inch Center Rectangular Leadless Package (Staggered Terminals). Item 11.10-165.D270
JEDEC MO-084-A 0
Registration - Ceramic Quad Flat Pack .050 inch Lead Spacing (Gullwing). Item 11.10-255.
JEDEC MO-083-A 0
Registration - .100 inch Center Plastic Pin Grid Array Family (Nonhermetic). Item 11.11-243.
JEDEC MO-082-A 0
Registration - Ceramic Quad Flat Pack .025 inch Lead Spacing (Gullwing). Item 11.10-246.
JEDEC MO-081-A 0
Registration - Ceramic Quadpack Family .050 inch Pitch, 68 Terminals, Type Q. Item 11.10-224.
JEDEC MO-080-A 0
Registration - ZIP Module Family 0.050 inch Pin Center, 0.100 inch Row Center, 23, 25, 26 and 28 Leads. Variations AA...
JEDEC MO-079-A 0
Registration - Center Hermetic Flanged Family with Peripheral Leads .125 Pitch. Item 11.10-217.
JEDEC MO-078-A 0
Registration - Hermetic Flange-Mounted Header Family, Peripheral Leads, .100 mil Pitch, 5 Leads. Item 11.10-249.
JEDEC MO-077-D 0
Registration - Small Outline J-Lead (SOJ) .300 inch Body, .050 inch Lead Spacing. Addition of a 42 Lead Package. Item...
JEDEC MO-076-A 0
Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier SO Series, Rectangular. Item 11.11-222.
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JEDEC JESD79-4-1B-2021
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JEDEC CS-002-A 1993
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
IPC JEDEC 9703-2009 (2019)
JEDEC JESD82-30.01-2023
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC JESD88E 2013
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline