JEDEC MO-041-C 0
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type E. Variations AA-AF. Item 11.10-350.
JEDEC MO-040-C 0
Registration - Power Module. Recission of Variation AB.
JEDEC MO-039-A 0
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .900 Row Spacing.
JEDEC MO-038-A 0
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, .600 Row Spacing.
JEDEC MO-037-A 0
Registration - Ceramic Side Leaded Dual-In-Line (DIP) Family, 10.16 mm Row Spacing. Item 11.10-375S.
JEDEC MO-036-B 0
Registration - Rescission of MO-036 Variations AB-AE, Update of Variation AA to a .288 inch Wide Body. Item 11.10-384...
JEDEC MO-035-A 0
Registration - Single-In-Line (SIP) Family. Item 11.3-79.
JEDEC MO-034-C 0
Registration - 64 Lead Quad In-Line Package (QUIP) Family .750/.925 inch Row Spacing. Addition of Variation AD. Item ...
JEDEC MO-033-B 0
Registration - Quad In Line (QUIP) Family 17.78/ 22.86 mm Row Spacing. Item 11.10-
JEDEC MO-032-C 0
Registration - Flatpack Family 16.64 mm Width, 1.27 Pitch. Variations AA-AF. Item 11.3-064.
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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
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JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC JESD88E 2013
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline