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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-065-A 0

JEDEC ★★★★★

JEDEC MO-065-A 0 Registration - Plastic Small Outline J-Lead (SOJ) .300 inch Wide Body Family, 0.050 Lead Spacing, 24 and 26 Pins. Item 11.11-216..

Publication date: 1970-12-01 Points: 540 File size: 74.68 KB Pages: 2 Format: PDF

JEDEC MO-064-C 0

JEDEC ★★★★★

JEDEC MO-064-C 0 Registration - 30 Pin Circuit Pluggable Single-In-Line Package (SIP) TABs on .100 inch Centers. Addition of Variation AE. Item 11.14-009.

Publication date: 1970-12-01 Points: 540 File size: 60.19 KB Pages: 2 Format: PDF

JEDEC MO-063-A 0

JEDEC ★★★★★

JEDEC MO-063-A 0 Registration - Plastic Small Outline J-Lead (SOJ) .350 inch Wide Body, .050 inch Lead Spacing, 26/20 Pin. Item 11.11-210..

Publication date: 1970-12-01 Points: 540 File size: 71.83 KB Pages: 2 Format: PDF

JEDEC MO-062-A 0

JEDEC ★★★★★

JEDEC MO-062-A 0 Registration - 148 Pin Leadless Ceramic Chip Carrier .025 inch mil Pitch. Item 11.10-235.

Publication date: 1970-12-01 Points: 540 File size: 93.28 KB Pages: 4 Format: PDF

JEDEC MO-061-A 0

JEDEC ★★★★★

JEDEC MO-061-A 0 Replaced - See MS-027-A. Item 11.11-404S.

Publication date: 1970-12-01 Points: 540 File size: 136.21 KB Pages: 4 Format: PDF

JEDEC MO-060-B 0

JEDEC ★★★★★

JEDEC MO-060-B 0 Registration - .040 inch, 132 Pin Quad Flatpack. Item 11.10-278.

Publication date: 1970-12-01 Points: 540 File size: 103.63 KB Pages: 4 Format: PDF

JEDEC MO-059-B 1987

JEDEC ★★★★★

JEDEC MO-059-B 1987 Registration - Small Outline (SO) Package Family 8.4 mm (.330 inch) Body Width (Plastic) with Increased Lead Thickness to 11.8 mil max. Item 11.11-214.

Publication date: 1987-12-01 Points: 540 File size: 84.89 KB Pages: 2 Format: PDF

JEDEC MO-058-B 0

JEDEC ★★★★★

JEDEC MO-058-B 0 Replaced - See MS-030-A. Item 11.10-374S. (Dual-In-Line CERDIP Family .300 inch Row Spacing. Item 11.10-385).

Publication date: 1970-12-01 Points: 540 File size: 128.29 KB Pages: 6 Format: PDF

JEDEC MO-057-A 0

JEDEC ★★★★★

JEDEC MO-057-A 0 Registration - Ceramic .020 inch Center Chip Carrier. Item 11.10-124

Publication date: 1970-12-01 Points: 540 File size: 570.47 KB Pages: 14 Format: PDF

JEDEC MO-056-A 0

JEDEC ★★★★★

JEDEC MO-056-A 0 Registration - Ceramic .025 inch Center Chip Carrier. Item 11.10-124.

Publication date: 1970-12-01 Points: 540 File size: 518.98 KB Pages: 13 Format: PDF

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JEDEC JESD79-3-3 2013

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ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline