JEDEC MO-055-A 0
Registration - Ceramic Single-In-Line Package (SIP) Family. Item 11.10-207.
JEDEC MO-054-A 0
Registration - Zig-Zag In-Line Package (ZIP) Family, 2.54 mm Row Spacing, 16 Pin. Item 11.11-133.
JEDEC MO-052-A 0
Replaced - See MS-016-A. (Plastic Chip Carrier (PCC) Family .050 inch Leadspacing, Rectangular).
JEDEC MO-048-A 0
Registration - Plastic Flange-Mounted Header Family Multilead Registration. Item 11.11-205.
JEDEC MO-047-B 0
Registration - Plastic Chip Carrier (PCC) Family .050 inch Lead Spacing, Square. Item 11.11-242.
JEDEC MO-046-B 0
Registration - Small Outline (SO) Package Peripheral Terminals 5.30 mm (.200 inch) Wide Body. Item 11.3-147.
JEDEC MO-045-A 0
Registration - Single-In-Line Power Module. Item 11.3-128.
JEDEC MO-044-A 0
Registration - Leaded Ceramic Chip Carrier .050 inch Center, 68 and 84 Terminals. Item 11.11-138.
JEDEC MO-043-A 0
Registration - Dual-In-Line Package 19.05 mm Row Spacing. Item 11.11-143.
JEDEC MO-042-A 0
Registration - .050 inch Center Leadless Rectangular Chip Carrier Type F. Item 11.3-101.
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Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
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JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline