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EXTENSION TO JESD51 THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
JEDEC JESD51-31 2008
THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
JEDEC JESD51-2A-2008
JEDEC JESD51-2A 2007
INTEGRATED CIRCUITS THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - NATURAL CONVECTION (STILL AIR)
JEDEC JESD51-14 2010
TRANSIENT DUAL INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR ...
JEDEC JESD51-13 2009
GLOSSARY OF THERMAL MEASUREMENT TERMS AND DEFINITIONS
JEDEC JESD51-12.01 2012
GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
JEDEC JESD51-11 2001
TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT:
JEDEC JESD51-10 2000
TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS:
JEDEC JESD51- 9 2000
TEST BOARDS FOR AREA ARRAY SURFACE MOUNT PACKAGE THERMAL MEASUREMENTS:
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