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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-249-A 2004

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JEDEC MO-249-A 2004 Registration - Thin Small Outline, Plastic Surface Mount Header, 8.89 mm Body Family. R-PDSO-G/TSOP11. Item 11.11-668.

Publication date: 2004-12-01 Points: 540 File size: 204.07 KB Pages: 6 Format: PDF

JEDEC MO-248-E 2006

JEDEC ★★★★★

JEDEC MO-248-E 2006 Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP.

Publication date: 2006-12-01 Points: 540 File size: 435.26 KB Pages: 12 Format: PDF

JEDEC MO-247-D 2007

JEDEC ★★★★★

JEDEC MO-247-D 2007 Registration - Plastic, Quad, No-Lead, Staggered, Multi-Row Packages. H(V,W,U)F-PQFN.

Publication date: 2007-12-01 Points: 540 File size: 876.21 KB Pages: 12 Format: PDF

JEDEC MO-246G 2015

JEDEC ★★★★★

JEDEC MO-246G 2015 Registration - Rectangular, Fine Pitch, Thin Ball Grid Array, 0.65 mm pitch. TFR-XBGA.

Publication date: 2015-12-01 Points: 540 File size: 420.88 KB Pages: 11 Format: PDF

JEDEC MO-245-A 2003

JEDEC ★★★★★

JEDEC MO-245-A 2003 Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. HE-PDFP-N. Item 11.11-638.

Publication date: 2003-12-01 Points: 540 File size: 114.89 KB Pages: 7 Format: PDF

JEDEC MO-244D 2012

JEDEC ★★★★★

JEDEC MO-244D 2012 Registration - 244 Pin DDR2/DDR3 Mini Dual-In-Line Memory Module (DIMM) Family, 0.60 mm Lead Centers.

Publication date: 2012-12-01 Points: 540 File size: 375.69 KB Pages: 14 Format: PDF

JEDEC MO-243-A 2003

JEDEC ★★★★★

JEDEC MO-243-A 2003 Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Bumped Quad Flat No Lead Package. HP-VFQFP-NB & HP-WFQFP-NB.

Publication date: 2003-12-01 Points: 540 File size: 152.07 KB Pages: 5 Format: PDF

JEDEC MO-242-C 2008

JEDEC ★★★★★

JEDEC MO-242-C 2008 Registration - Rectangular Die-Size, Stacked Ball Grid Array Family, 0.80 mm Pitch. AF1R-PDSB.

Publication date: 2008-12-01 Points: 540 File size: 122.58 KB Pages: 12 Format: PDF

JEDEC MO-241-B 2003

JEDEC ★★★★★

JEDEC MO-241-B 2003 Registration - Dual in-line compatible, thermally enhanced, plastic very thin fine pitch, QFN package family, includes addition of Very Thin Profile variations. HW-PQFP-N/HV-PQFP-N/PSO-N. Item 11.11-662.

Publication date: 2003-12-01 Points: 540 File size: 70.92 KB Pages: 4 Format: PDF

JEDEC MO-240C 2012

JEDEC ★★★★★

JEDEC MO-240C 2012 Registration - Thermally Enhanced, 8 Lead, 1.27 & 0.65 mm Pitch, Thin, Very Very thin, and Ultra Thin Plastic Dual Flat, No Lead Package. H(T, W, U)-PSON.

Publication date: 2012-12-01 Points: 540 File size: 309.4 KB Pages: 6 Format: PDF

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JEDEC JEP162A-2019

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jedec JEP 122G

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JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.

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JEDEC JESD79-3-3 2013

JEDEC JESD79-3-3 2013

ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline