JEDEC MO-190-D 2001
Registration - 144 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family 0.8 mm Lead Centers with addition of op...
JEDEC MO-189-A 0
Registration - Plastic QFP/Heat Slug (H-LQP/G) 2.00 mm Thick/2.00 mm Footprint. Item 11.11-451.
JEDEC MO-188-B 0
Registration - Power PQFP with Heat Slug. Item 11.11-559.
JEDEC MO-187-F 2010
Registration - Plastic Low/Thin/Very Thin Shrink Small Outline Package, 0.65 AND 0.50 Pitch. (H)(L,T,V)SR-PDSO.
JEDEC MO-186-C 0
Registration - Solid State Floppy Disk Card, 32Contact. Item 11.14-035. Editorial Correction of the TAB Clearance Dim...
JEDEC MO-185-A 0
Registration - 72 Pin Staggered Dual-Inline Module (SDIM) Family. Item 11.14-022.
JEDEC MO-184-B 0
Registration - Small Outline Heat Slug Variation B: Addition of Longer Foot (L) Variations to SOP. Item 11.11-548.
JEDEC MO-183-A 0
Registration - TSOP I, 0.55 mm Pitch, 28 Leads. Item 11.11-426.
JEDEC MO-182-C 0
Registration - Metric TSOP II, 16 mm Body Width, 40 and 62 Leads. Item 11.11-454.
JEDEC MO-181-A 0
Registration - Plastic Metric Small Outline J-Lead (MSOJ) Package, 16 mm Wide Body, 40 Pin. R-PDSO-J/SOJ. Item 11.11-...
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JEDEC CS-002-A 1993
Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
IPC JEDEC 9703-2009 (2019)
JEDEC JESD82-30.01-2023
JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
EIA JEDEC JESD67-1999 errata 1999
JEDEC JESD88E 2013
DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition
JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline