JEDEC MO-200-B 0
Registration - Small Outline J-Lead Package Assembly 2 High/4 High Stack. Item 11.11-513.
JEDEC MO-199-B 0
Registration - Low Profile Small Outline J-Lead Package (LSOJ). Addition of 66 Lead Variation. Item 11.11-512.
JEDEC MO-198-A 0
Registration - 3-Tier Family. PQFP-B. Item 11.11-473.
JEDEC MO-197-B 0
Registration - Plastic Ultra-Thin Small Outline No-Lead Package 0.5mm Pitch. Item 11.11-498.
JEDEC MO-196-C 0
Registration - Plastic Ultra-Thin Small Outline, No Lead Package. Item 11.11-508.
JEDEC MO-195-D 2006
Registration - Thin, Fine Pitch Ball Grid Array Family, 0.5 mm Pitch. TF(R)-XBGA.
JEDEC MO-194-B 0
Registration - TSSOP/HSSOP, 0Plastic Thin Shrink Small Outline Package. 0.40 mm Lead Pitch. Item 11.11-492.
JEDEC MO-193E 2013
Registration - Plastic Thin Shrink Small Outline Package (Shrink SOT). TR-PDSO-G.
JEDEC MO-192-F 2003
Registration - Low Profile Square Ball Grid Array Family. S-LBGA-B/LBGA.
JEDEC MO-191-A 0
Registration - 160 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Lead Centers. Item 11.14-027.
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JEDEC CO-022-A 0
Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
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JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline