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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-210N 2016

JEDEC ★★★★★

JEDEC MO-210N 2016 Registration - Fine Pitch Ball Grid Array Family, Rectangular, 0.80 mm Pitch. (V,T,L)FR-XBGA.

Publication date: 2016-12-01 Points: 540 File size: 777.35 KB Pages: 21 Format: PDF

JEDEC MO-209-A 0

JEDEC ★★★★★

JEDEC MO-209-A 0 Registration - Plastic Thin Shrink Fine Pitch Small Outline No Lead (TFSON) Package. Item 11.11-507.

Publication date: 1970-12-01 Points: 540 File size: 190.64 KB Pages: 5 Format: PDF

JEDEC MO-208-C 2001

JEDEC ★★★★★

JEDEC MO-208-C 2001 Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599.

Publication date: 2001-12-01 Points: 540 File size: 209.46 KB Pages: 9 Format: PDF

JEDEC MO-207N 2013

JEDEC ★★★★★

JEDEC MO-207N 2013 Registration - Square and Rectangular Die-Size, Ball Grid Array Family. (L, T, V, W) F (R)- xDSB.

Publication date: 2013-12-01 Points: 540 File size: 861.45 KB Pages: 26 Format: PDF

JEDEC MO-206-E 2006

JEDEC ★★★★★

JEDEC MO-206-E 2006 Registration - Dual Inline Memory Module (DIMM) Family, 184 Pin DDR w/ 1.27 mm Contact Centers. Item 11.14-078

Publication date: 2006-12-01 Points: 540 File size: 509.42 KB Pages: 9 Format: PDF

JEDEC MO-205-G 2006

JEDEC ★★★★★

JEDEC MO-205-G 2006 Registration - Low Profile, Fine Pitch BGA Family, 0.80 mm Pitch (Rectangular). LFR-XBGA. Item 11.11-752.

Publication date: 2006-12-01 Points: 540 File size: 552.54 KB Pages: 7 Format: PDF

JEDEC MO-204-B 2001

JEDEC ★★★★★

JEDEC MO-204-B 2001 Registration - Plastic Quad Flatpack (PQFP) Outline with Exposed Heat Sink. Thermally Enhanced PQFPs. Addition of standard height, variations BA, BB, BC, BD, and BE with Exposed Heat Sink.

Publication date: 2001-12-01 Points: 540 File size: 459.64 KB Pages: 8 Format: PDF

JEDEC MO-203C 2010

JEDEC ★★★★★

JEDEC MO-203C 2010 Registration - Plastic Thin Shrink Small Outline (Shrink SOT). R-PDSO-G

Publication date: 2010-12-01 Points: 540 File size: 259.89 KB Pages: 5 Format: PDF

JEDEC MO-202-A 0

JEDEC ★★★★★

JEDEC MO-202-A 0 Registration - Verticle Zig-Zag Surface Mount Package, 0.40 mm Lead Pitch, Plastic ZIP Package. Item 11.11-496.

Publication date: 1970-12-01 Points: 540 File size: 159.96 KB Pages: 4 Format: PDF

JEDEC MO-201-A 1997

JEDEC ★★★★★

JEDEC MO-201-A 1997 Registration - Stacked TSOPII Package (2 and 4 High). Item 11.11-429.

Publication date: 1997-12-01 Points: 540 File size: 22.23 KB Pages: 1 Format: PDF

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jedec JEP 122G

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JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.

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JEDEC JESD79-3-3 2013

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ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline