JEDEC MO-180-B 2001
Registration - Plastic SOP, 13.30 mm Wide Body, 1.27 mm Pitch, with addition of a 90 lead Small Outline Package as va...
JEDEC MO-179-A 0
Registration - 278 Pin Dual-In-Line Meory module (DIMM) Family with 1.00 Lead Centers. Item 11.14-021.
JEDEC MO-178-C 0
Registration - 5 Pin SOT, 6 and 8 lead. Variations AB and BA to SOT. Item 11.10-397.
JEDEC MO-177-A 1999
Registration - Rescission of 200 Pin Small Outline Dual-In-Line Memory Module (DIMM) Family, 0.65 mm Pitch. Item 11.1...
JEDEC MO-176-A 0
Registration - Ceramic Zig Zag In-Line Family (2.54 mm Row Spacing). Item 11.10-353.
JEDEC MO-175-A 0
Registration - 44 and 48 Pin Plastic SOP, 12.6 mm Body, 1.27 mm Pitch. Item 11.11-412.
JEDEC MO-174-A 0
Registration - Plastic Shrink Small Outline Package (SSOP), 70-pin .8 mm Pitch, 3.9 mm Wide Body. Addition of 0.4 mm ...
JEDEC MO-173-A 0
Registration - Thin Quad Flatpack Family with Integral Heat Spreader. Item 11.11-403.
JEDEC MO-172-D 0
Registration - 112 & 200 Pin Dual-In-Line Memory Module (DIMM) Family, 1.27 mm Pitch. Item 11.14-041.
JEDEC MO-171-A 0
Registration - 88 Pin Memory Card. Item 11.14-012.
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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...
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Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.
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JEDEC SO-009A 2007
Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.
JEDEC SO-005A 2005
Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline