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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-075-A 0

JEDEC ★★★★★

JEDEC MO-075-A 0 Registration - .050 inch Center Non-Hermetic Leadless Chip Carrier Quad Series, Square. Item 11.11-221.

Publication date: 1970-12-01 Points: 540 File size: 164.11 KB Pages: 5 Format: PDF

JEDEC MO-074-A 0

JEDEC ★★★★★

JEDEC MO-074-A 0 Registration - Ceramic Bottom Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.

Publication date: 1970-12-01 Points: 540 File size: 66.84 KB Pages: 2 Format: PDF

JEDEC MO-073-A 0

JEDEC ★★★★★

JEDEC MO-073-A 0 Registration - Ceramic Top Brazed Dual-In-Line Package (DIP) Family .900(22.86) Row Spacing. Item 11.10-206.

Publication date: 1970-12-01 Points: 540 File size: 67.62 KB Pages: 2 Format: PDF

JEDEC MO-072-B 0

JEDEC ★★★★★

JEDEC MO-072-B 0 Registration - 40 Lead Zig-Zag In-Line Package Family (ZIP) 0.500 inch Max Seated Height. Addition of Variation AE. Item 11.11-284.

Publication date: 1970-12-01 Points: 540 File size: 88.8 KB Pages: 2 Format: PDF

JEDEC MO-071-B 0

JEDEC ★★★★★

JEDEC MO-071-B 0 Registration - Plastic Thin Lead Package Family Square (Gullwing). Item 11.11-239/240.

Publication date: 1970-12-01 Points: 540 File size: 211.28 KB Pages: 6 Format: PDF

JEDEC MO-070-A 0

JEDEC ★★★★★

JEDEC MO-070-A 0 Registration - Rectangular Ceramic .375 inch Nominal Width Flatpack Family. Item 11.10-233.

Publication date: 1970-12-01 Points: 540 File size: 139.16 KB Pages: 6 Format: PDF

JEDEC MO-069-B 0

JEDEC ★★★★★

JEDEC MO-069-B 0 Registration - Plastic Quad Flatpack .025 inch Lead Spacing (Gullwing). Item 11.11-285.

Publication date: 1970-12-01 Points: 540 File size: 323.94 KB Pages: 13 Format: PDF

JEDEC MO-068-B 0

JEDEC ★★★★★

JEDEC MO-068-B 0 Registration - Edge Clip SIP Module Family, .100 Row Centers. Addition of Variation AF. Item 11.14-004.

Publication date: 1970-12-01 Points: 540 File size: 168.67 KB Pages: 6 Format: PDF

JEDEC MO-067-B 0

JEDEC ★★★★★

JEDEC MO-067-B 0 Registration - .100 inch Center Ceramic Pin Grid Array Family (Large Outline). Item 11.10-122.

Publication date: 1970-12-01 Points: 540 File size: 316.93 KB Pages: 8 Format: PDF

JEDEC MO-066-C 0

JEDEC ★★★★★

JEDEC MO-066-C 0 Registration - .100 inch Center Ceramic Pin Grid Array Family (Small Outline). Item 11.10-122.

Publication date: 1970-12-01 Points: 540 File size: 243.13 KB Pages: 6 Format: PDF

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JEDEC JESD79-3-3 2013

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline