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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-239-B 2002

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JEDEC MO-239-B 2002 Registration - Thermally Enhanced Plastic Very Thin Dual Row Fine Pitch Quad Flat No Lead Package. HP-VFQFP-N. Item 11.11-680

Publication date: 2002-12-01 Points: 540 File size: 246.71 KB Pages: 7 Format: PDF

JEDEC MO-238-A 2003

JEDEC ★★★★★

JEDEC MO-238-A 2003 Registration - Stacked TSOP II Package Family (2 High). R-PDSO-G. Item 11.11-635

Publication date: 2003-12-01 Points: 540 File size: 98.94 KB Pages: 4 Format: PDF

JEDEC MO-237-G.01 2011

JEDEC ★★★★★

JEDEC MO-237-G.01 2011 Registration - DDR2 SDRAM DIMM (Dual Inline Memory Module) Family with 1.00 mm Contact Centers.

Publication date: 2011-12-01 Points: 540 File size: 497.47 KB Pages: 8 Format: PDF

JEDEC MO-236C 2010

JEDEC ★★★★★

JEDEC MO-236C 2010 Registration - Plastic, Ultra and Super Thin, Small Outline, No Lead Package. (U, X2) F-PSON.

Publication date: 2010-12-01 Points: 540 File size: 297.31 KB Pages: 9 Format: PDF

JEDEC MO-235-B 2003

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JEDEC MO-235-B 2003 Registration - Plastic peripheral leaded, flange mounted package family with revision of lead dimensions (5 lead). R-PSFM-G. Item 11.10-423.

Publication date: 2003-12-01 Points: 540 File size: 72.39 KB Pages: 4 Format: PDF

JEDEC MO-234C 2017

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JEDEC MO-234C 2017 Registration - Ball Grid Array Family, Rectangular, 1.00 mm Pitch. PBGA.

Publication date: 2017-12-01 Points: 540 File size: 613.64 KB Pages: 18 Format: PDF

JEDEC MO-233-C 2003

JEDEC ★★★★★

JEDEC MO-233-C 2003 Registration - Mixed Pitch (0.80 & 1.00 mm), Rectangular Die Size, Fine Dual Pitch Ball Grid Array (DSBGA) family. TFR-XBGA-N. Item 11.4-611

Publication date: 2003-12-01 Points: 540 File size: 232.58 KB Pages: 5 Format: PDF

JEDEC MO-232-A 2001

JEDEC ★★★★★

JEDEC MO-232-A 2001 Registration - Thermally Enhanced Low Profile Plastic Dual, Flat No Lead Package. L-PDFP-N. Item 11.10-412

Publication date: 2001-12-01 Points: 540 File size: 78.65 KB Pages: 4 Format: PDF

JEDEC MO-231-A 2001

JEDEC ★★★★★

JEDEC MO-231-A 2001 REGISTRATION - Thermally enhanced single in-line surface mount package. 21.50 mm Body Width, 1.40 mm Lead Pitch. R-PSIP-Fxx. Item 11.11-590.

Publication date: 2001-12-01 Points: 540 File size: 110.98 KB Pages: 3 Format: PDF

JEDEC MO-230-A 2001

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JEDEC MO-230-A 2001 Registration - Plastic Small Outline Package with Exposed Heat Sink.

Publication date: 2001-12-01 Points: 540 File size: 85.58 KB Pages: 4 Format: PDF

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JEDEC JESD79-3-3 2013

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ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline