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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-229F 2012

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JEDEC MO-229F 2012 Registration - Thermally Enhanced Plastic Very Thin, Very Very Thin, and Ultra Thin Fine Pitch Small Outline No Lead Package Family. H(V, W, U)F-PSON

Publication date: 2012-12-01 Points: 540 File size: 934.16 KB Pages: 15 Format: PDF

JEDEC MO-228-A 2001

JEDEC ★★★★★

JEDEC MO-228-A 2001 Registration - Square, Dual Pitch, FBGA Family. Item 11.11-581.

Publication date: 2001-12-01 Points: 540 File size: 214.63 KB Pages: 5 Format: PDF

JEDEC MO-227-A 2000

JEDEC ★★★★★

JEDEC MO-227-A 2000 Registration - 232 Pin DDR SDRAM DIMM Family, 1.00 mm Pitch. Item 11.14-042

Publication date: 2000-12-01 Points: 540 File size: 107.82 KB Pages: 1 Format: PDF

JEDEC MO-226-B 2001

JEDEC ★★★★★

JEDEC MO-226-B 2001 Registration - Change the A4 dimension and value in the Plastic Small Outline Heatslug Package , 7.50 mm Body Wide, 1.0 mm Lead Pitch (H-PDSO-G). Item 11.11-589.

Publication date: 2001-12-01 Points: 540 File size: 81.65 KB Pages: 3 Format: PDF

JEDEC MO-225-C 2007

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JEDEC MO-225-C 2007 Registration - Very Thin, Fine-Pitch, Square Ball Grid Array Family, 0.50/0.65 mm pitch. VF-XBGA.

Publication date: 2007-12-01 Points: 540 File size: 339.21 KB Pages: 6 Format: PDF

JEDEC MO-224-E 2006

JEDEC ★★★★★

JEDEC MO-224-E 2006 Registration - 200 Pin DDR Small Outline Dual-In-Line Memory Module (SODIMM) Family, 0.60 mm Contact Centers. Item 11.14-077. Key tolerance corrected

Publication date: 2006-12-01 Points: 540 File size: 299.12 KB Pages: 10 Format: PDF

JEDEC MO-223-A 0

JEDEC ★★★★★

JEDEC MO-223-A 0 Registration - 5, 6, and 8 Lead Plastic Thin Shrink Small Outline Package (TSSOP) to Align with EIAJ Standard SC-88. Item 11.10-402.

Publication date: 1970-12-01 Points: 540 File size: 176.35 KB Pages: 4 Format: PDF

JEDEC MO-222-B.01 2010

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JEDEC MO-222-B.01 2010 Registration - Very Thin Profile, Fine Pitch, Bump Grid Array Family, 0.50 & 0.65 mm Pitch, Rectangular. VFR-XBGA.

Publication date: 2010-12-01 Points: 540 File size: 206.09 KB Pages: 6 Format: PDF

JEDEC MO-221-C 2001

JEDEC ★★★★★

JEDEC MO-221-C 2001 Registration - Extremely Thin, Two Row Cavity Down, 0.50 mm Pitch BGA Family. The addition of -2, max matrix, variations to XFBGA. Item 11.11-604.

Publication date: 2001-12-01 Points: 540 File size: 155.44 KB Pages: 3 Format: PDF

JEDEC MO-220-K.01 2011

JEDEC ★★★★★

JEDEC MO-220-K.01 2011 Registration - Thermally Enhanced Plastic Very Thin and Very Very Thin Fine Pitch Quad Flat No Lead Package. HVF-PQFN, HWF-QFN.

Publication date: 2011-12-01 Points: 540 File size: 771.11 KB Pages: 20 Format: PDF

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jedec JEP 122G

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JEDEC JEP122G provides reliability models and acceleration factors for common semiconductor device failure mechanisms.

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JEDEC JESD79-3-3 2013

JEDEC JESD79-3-3 2013

ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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IPC JEDEC 9301-2018

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC JESD82-30.01-2023

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JEDEC CO-022-A 0

JEDEC CO-022-A 0

Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

JEDEC JESD88E 2013

DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline