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JEDEC

Joint Electron Device Engineering Council

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JEDEC MO-220-D 2002

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JEDEC MO-220-D 2002 Registration - Consolidation and addition of numerous variations to the thermally enhanced plastic very thin fine pitch quad flat, no lead package. HP-VFQFP-N/HP-WFQFP-N. Item 11.11-620.

Publication date: 2002-12-01 Points: 540 File size: 3.97 KB Pages: 1 Format: PDF

JEDEC MO-219-G 2007

JEDEC ★★★★★

JEDEC MO-219-G 2007 Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). LF-XBGA, LFR-XBGA.

Publication date: 2007-12-01 Points: 540 File size: 590.83 KB Pages: 13 Format: PDF

JEDEC MO-218-A 0

JEDEC ★★★★★

JEDEC MO-218-A 0 Registration - Plastic Flange-Mounted Staggered Header Family, 7 & 9 Lead TO Style Package. Item 11.10-393

Publication date: 1970-12-01 Points: 540 File size: 89.03 KB Pages: 4 Format: PDF

JEDEC MO-217-B 2001

JEDEC ★★★★★

JEDEC MO-217-B 2001 Registration - Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621.

Publication date: 2001-12-01 Points: 540 File size: 537.93 KB Pages: 6 Format: PDF

JEDEC MO-216-E 2003

JEDEC ★★★★★

JEDEC MO-216-E 2003 Registration - Thin Profile, Square and Rectangular, Ball Grid Array (BGA) Family, for 1.00 mm and 0.80 mm Pitch. T-XBGA, TF-XBGA, TR-XBGA. Item 11.11-658.

Publication date: 2003-12-01 Points: 540 File size: 194.39 KB Pages: 9 Format: PDF

JEDEC MO-215-A 2000

JEDEC ★★★★★

JEDEC MO-215-A 2000 Registration - 210 Pin SDRAM Dual-In-Line Memory Module (DIMM) Family, 1.00 mm Contact Centers. Item 11.14-039. This Outline is Now Inactive. Item 11.14-047.

Publication date: 2000-12-01 Points: 540 File size: 3.91 KB Pages: 1 Format: PDF

JEDEC MO-214-B 2002

JEDEC ★★★★★

JEDEC MO-214-B 2002 Registration - Addition of 172 pin Micro DIMM variations and modification of terminal postional tolerance to Micro DIMM registration. Item 11.14-049.

Publication date: 2002-12-01 Points: 540 File size: 209.69 KB Pages: 6 Format: PDF

JEDEC MO-213-A 1969

JEDEC ★★★★★

JEDEC MO-213-A 1969 Registration - Horizontal Staggered Surface Mount Package 0.40 mm Lead Pitch. Item 11.11-514.

Publication date: 1969-12-01 Points: 540 File size: 123.43 KB Pages: 4 Format: PDF

JEDEC MO-212-A 0

JEDEC ★★★★★

JEDEC MO-212-A 0 Registration - Rectangular Plastic Quad Flat Package, 1.0 mm Thick Body, 3.2 mm Footprint. Item 11.11-511.

Publication date: 1970-12-01 Points: 540 File size: 183.61 KB Pages: 5 Format: PDF

JEDEC MO-211-C 2004

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JEDEC MO-211-C 2004 Registration - Die Size Ball Grid Array, Fine Pitch, Thin/Very Thin/Extremely Thin Profile. X-DSBGA. Item 11.4-631.

Publication date: 2004-12-01 Points: 540 File size: 243.18 KB Pages: 7 Format: PDF

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JEDEC JESD79-3-3 2013

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ADDENDUM No. 3 to JESD79-3 - 3D STACKED SDRAM

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JEDEC CS-002-A 1993

JEDEC CS-002-A 1993

Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Ite...

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IPC JEDEC 9703-2009 (2019)

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JEDEC CO-022-A 0

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Registration - Plastic Magazine Plug Family. Variations AA-AC. Item 11.5-340.

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EIA JEDEC JESD67-1999 errata 1999

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JEDEC JESD88E 2013

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DICTIONARY OF TERMS FOR SOLID-STATE TECHNOLOGY, 6th Edition

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JEDEC SO-009A 2007

JEDEC SO-009A 2007

Registration - DDR2 DIMM 240 Pin SMT Socket Outline with 1.00 mm Contact Centers. Item 11.14-097.

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JEDEC SO-005A 2005

JEDEC SO-005A 2005

Registration - 200 pin Mini DIMM with 0.60 mm Lead Centers Socket Outline